The Dutch photolithography giant ASML has announced plans to work with major chipmaking customers to usher in the next generation of advanced semiconductor production.
ASML is the world’s only producer of extreme ultraviolet (EUV) lithography machines, used to print intricate circuit patterns on silicon wafers with nanometre-scale precision.
These systems are used by the world’s largest semiconductor manufacturers, including Taiwan Semiconductor Manufacturing Company (TSMC) and Samsung Electronics, for advanced chip production.
During EUV lithography, pulses of ultraviolet light are shone onto the wafers through what is known as a mask, a 6-inch square semi-transparent plate covered with circuit designs. ASML has recently introduced its newest tools, High NA EUV lithography systems, which can print chip designs up to 1.7 times smaller than standard EUV systems.
In tandem, chipmakers have agreed to work with ASML to introduce 12-inch photomasks. These will allow manufacturers to print circuit patterns onto the large semiconductors used in data centres without needing to ‘stich’ together many smaller designs, as is the case with 6-inch photomasks.
As a result, manufacturers expect them to speed up the rate at which chips can be produced.
Samsung Electronics has confirmed it will use ASML’s High NA EUV into its production lines for dynamic random-access memory, a crucial memory component for data centres, in 2028.
The chip giant said its adoption of 12-inch masks will improve its fabrication productivity and lower chipmaking costs.
Young Hyun Jun, vice chairman and chief executive of Samsung Electronics, said: “The AI era is transforming the semiconductor industry and increasing the importance of technological innovation across the entire value chain.
“Samsung is committed to maintaining leadership in advanced semiconductor manufacturing, including memory and foundry, through breakthrough technologies and strong partnerships. By further strengthening our collaboration with ASML, we are helping lay the foundation for the next generation of AI and semiconductor innovation.”
TSMC, producer of around 90 per cent of the world’s advanced semiconductors, has also committed to using ASML’s High NA technology in advanced chip production from 2030 onwards, with a pilot line of 12-inch masks in place by 2031.
TSMC added that this will support the rollout of 12-inch masks as standard for advanced node production by 2033.
