SK Hynix intends to double its wafer capacity over the next five years in order to meet rising demand, according to the South Korean chipmaker’s chairman Chey Tae-won.
Speaking at Computex in Taiwan on Tuesday, Chey said: “We are going to double the whole capacity over the next five years […] there are a lot of obstacles and hurdles, but we will get over them and expand.”
SK Hynix is a key component supplier for firms such as Nvidia, Google, and Microsoft, which use its DRAM, NAND flash, and high-bandwidth memory (HBM) in AI data centres. It holds 58 per cent of the market share for HBM and faces continued demand from hyperscalers as they seek to expand AI infrastructure.
At the conference, Chey additionally predicted that shortages of memory chips could continue until 2030, urged the components industry to focus on sustainable growth, and said SK Hynix would seek further partnerships in Taiwan beyond its existing tie-up with TSMC, the world’s largest chipmaker.
“We have to continue to grow, but sudden jumps in prices can become a problem and actually hurt sustainability,” he added.
In February, Bloomberg reported that SK Hynix had already sold out its entire stock of memory chips for 2026.
Chey added that Nvidia’s plans for personal computers powered by its RTX Spark Superchip would increase memory demand further. He also indicated that SK Hynix hopes to provide memory for Nvidia’s next-generation Vera Rubin chips ahead of their third and fourth quarter launch.
SK Hynix has benefited from intense demand for HBM in recent years, having hit a $1 trillion valuation for the first time last week.
