Intel appoints former SK Hynix CEO as VP of Intel Foundry in chiplet push

Intel has appointed Seok-Hee Lee as executive vice president of Intel Foundry, in a move to expand its chip offering to include advanced chiplets.

Lee will oversee advanced packaging, back-end manufacturing, back-end technology development, and system integration at the chip giant.

Advanced packaging is a technique in which multiple chips are combined into a single package, often by stacking silicon components.

Lee’s experience includes over two years as president and chief executive of SK On, a Korean battery company owned by SK Group.

Prior to this, he spent nine years as an executive at semiconductor giant SK Hynix, serving as president and chief executive at the firm for over three years, and a decade at Intel.

Lip-Bu Tan, chief executive of Intel, said the chip giant will benefit from Lee’s insights as it works to ramp advanced packaging and scale its production to meet customer and partner demand.

“Advanced packaging and system integration are becoming defining capabilities for next-generation computing systems,” said Tan.

“Seok-Hee brings deep expertise in leading complex, high-scale technology and manufacturing organizations, along with a strong track record of operational execution.”

Recent examples of the technology by Intel include Embedded Multi-die Interconnect Bridge-T , its advanced packaging solution for scaling Intel chips to meet AI compute demands, and Hybrid Bonding Interconnect, a 3D interconnect that reduces chip-to-chip latency and increases bandwidth.

Alongside the appointment, executive vice president Navid Shahriari will be retiring after 37 years at Intel.